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Packaging of RF Mems Switching Functions on Alumina Substrate

Published 21 Nov 2007 in cs.OH | (0711.3297v1)

Abstract: Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it offers lower power consumption, lower losses, higher linearity and higher Q factors compared with conventional communications components. To accelerate commercialisation of RF MEMS products, development for packaging technologies is one of the most critical issues should be solved beforehand.

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