Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation
Abstract: Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die configurations. It becomes increasingly important to perform thermal analysis in the early design phases to validate the architectural design decisions. This is even more critical for microfluidic cooling equipped 3DICs as the embedded cooling structures greatly influence the performance, power, and reliability of the stacked system. We exploited the existing architectural simulators and developed a Pre-register-transfer-level (Pre-RTL) thermal simulation methodology named Hot-LEGO that integrates these tools with their latest features such as support for microfluidic cooling and 3DIC stacking configurations. This methodology differs from existing ones by looking into the design granularity at a much finer level which enables the exploration of unique architecture combinations across the vertical stack. Though architectural-level simulators are not designed for signoff-calibre, it offers speed and agility which are imperative for early design space exploration. We claim that this ongoing work will speed up the co-design cycle of microfluidic cooling and offer a portable methodology for architects to perform exhaustive search for the optimal microarchitecture solutions in 3DICs.
- 2013. McPAT. https://code.google.com/archive/p/mcpat/
- 2017. CACTI. https://github.com/HewlettPackard/cacti
- 2022. HotSpot 7.0. https://github.com/uvahotspot/HotSpot
- 2023. Gem5. https://www.gem5.org/
- 2023. The Sniper Multi-Core Simulator. https://snipersim.org/w/The_Sniper_Multi-Core_Simulator
- The PARSEC benchmark suite: Characterization and architectural implications. In Proceedings of the 17th international conference on Parallel architectures and compilation techniques. 72–81.
- The gem5 simulator. ACM SIGARCH computer architecture news 39, 2 (2011), 1–7.
- A survey of optimization techniques for thermal-aware 3D processors. Journal of Systems Architecture 97 (2019), 397–415.
- Sniper: Exploring the level of abstraction for scalable and accurate parallel multi-core simulation. In Proceedings of 2011 International Conference for High Performance Computing, Networking, Storage and Analysis. 1–12.
- From 2.5 D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0. In 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). IEEE, 1–6.
- Microfluidic Cooling for 3D-IC with 3D Printing Package. In 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). 1–3. https://doi.org/10.1109/S3S46989.2019.9320506
- Thermal simulation of processing-in-memory devices using HotSpot 7.0. In 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, 1–5.
- Challenges for 3D IC integration: bonding quality and thermal management. In 2007 IEEE International Interconnect Technology Conferencee. IEEE, 210–212.
- McPAT: An integrated power, area, and timing modeling framework for multicore and manycore architectures. In Proceedings of the 42nd annual ieee/acm international symposium on microarchitecture. 469–480.
- Shailja Pandey and Preeti Ranjan Panda. 2022. NeuroMap: Efficient Task Mapping of Deep Neural Networks for Dynamic Thermal Management in High-Bandwidth Memory. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 41, 11 (2022), 3602–3613.
- Premkishore Shivakumar and Norman P Jouppi. 2001. Cacti 3.0: An integrated cache timing, power, and area model. (2001).
- CoreMemDTM: Integrated processor core and 3D memory dynamic thermal management for improved performance. In 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE, 1377–1382.
- CoMeT: An integrated interval thermal simulation toolchain for 2D, 2.5 D, and 3D processor-memory systems. ACM Transactions on Architecture and Code Optimization (TACO) 19, 3 (2022), 1–25.
- HotSpot: Techniques for modeling thermal effects at the processor-architecture level. THERMINIC.
- HotSpot Through the Ages. In HSSB: HotSpots Strike Back, co-located with ISCA. 1–2. https://sites.tufts.edu/tcal/files/2022/06/ISCA22_HSSB_paper_3.pdf
- Analysis of critical thermal issues in 3D integrated circuits. International Journal of Heat and Mass Transfer 97 (2016), 337–352.
- Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs. Microelectronics Journal 45, 12 (2014), 1814–1821.
- 3D integrated circuit cooling with microfluidics. Micromachines 9, 6 (2018), 287.
- The SPLASH-2 programs: Characterization and methodological considerations. ACM SIGARCH computer architecture news 23, 2 (1995), 24–36.
Paper Prompts
Sign up for free to create and run prompts on this paper using GPT-5.
Top Community Prompts
Collections
Sign up for free to add this paper to one or more collections.